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Fast Recovery High Voltage Diode Assemblies
MOSFET switches and free-wheeling diodes: In general the forward voltage of an intrinsic MOSFET switch diode is lower than the forward voltage of an external fast free-wheeling diode. In order to keep the reverse currents safely away from the intrinsic diodes it is neccessary to connect a so called “Blocking Diode” in series to a MOSFET switch. Therefore we always suggest to use this additional blocking diode when MOSFET switches shall be protectted by fast free-wheeling diodes. The blocking diode must have at least the peak current capability of the switch. The hold-off voltage is uncritical and must only be higher than the forward voltage difference between intrinsic diode and free-wheeling diode. The difference is usually some ten volts, in extreme cases some hundred volts (large MOSFET stacks and extremely high peak currents). Sufficient blocking diodes are available as single part component or as an integrated part component of a BEHLKE FDA diode (integrated blocking diode, option IBD and IBD-C).
Features:
- for HTS switches in combination with inductive load
- Soft recovery characteristics
- High peak current capability
- Very low inductance, short recovery time
| Model | Voltage (kV) | Peak Current (A) | Dimensions (mm3 ) | Datasheet |
| FDA 60-180 | 6 | 1800 | 78 x 76 x 25 | |
| FDA 60-240 | 6 | 2400 | 102 x 76 x 25 | |
| FDA 100-75 | 10 | 750 | 84 x 35 x 30 |  |
| FDA 100-150 | 10 | 1500 | 84 x 35 x 30 | |
| FDA 160-75 | 16 | 750 | 84 x 35 x 30 | |
| FDA 160-150 | 16 | 1500 | 84 x 35 x 30 | |
| FDA 100-300 | 16 | 3000 | 84 x 70 x 35 | |
| FDA 160-300 | 16 | 3000 | 103 x 70 x 35 | |
| FDA 200-75 | 20 | 750 | 101 x 35 x 30 | |
| FDA 200-150 | 20 | 1500 | 101 x 35 x 30 | |
| FDA 200-300 | 20 | 3000 | 103 x 70 x 35 | |
| FDA 240-75 | 24 | 750 | 116 x 35 x 30 | |
| FDA 240-150 | 24 | 1500 | 116 x 35 x 30 | |
| FDA 240-300 | 24 | 3000 | 116 x 70 x 35 | |
| FDA 300-75 | 30 | 750 | 141 x 35 x 30 | |
| FDA 300-150 | 30 | 1500 | 141 x 35 x 30 | |
| FDA 320-75 | 32 | 750 | 152 x 35 x 30 | |
| FDA 320-150 | 32 | 1500 | 152 x 35 x 30 | |
| FDA 320-300 | 32 | 3000 | 152 x 70 x 35 | |
| FDA 350-150 | 35 | 1500 | 205 x 35 x 30 | |
| FDA 640-75 | 64 | 750 | 300 x 35 x 35 | |
| FDA 640-150 | 64 | 1500 | 300 x 53 x 53 | |
| FDA 640-300 | 64 | 3000 | 300 x 70 x 35 | |
| FDA 800-75 | 80 | 750 | 400 x 35 x 35 | |
| FDA 800-150 | 80 | 1500 | 400 x 53 x 53 | |
| FDA 800-300 | 80 | 3000 | 370 x 70 x 35 | |
| FDA 1500-300 | 150 | 3000 | 700 x 70 x 35 |
| Options | Description |
| IBD | Integrated Blocking Diode. Hold-off voltage >1200 VDC |
| IBD-C | Integrated Blocking Diode. Customized (e.g.higher peak.currents |
| PT-HV | Pigtails for HV Connection: Flexible leads with cable lugs. Not recommended in extremely fast circuits. |
| UL94 | Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
| ITC | Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. |
| CF | Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants. |
| CF-1 | Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil). |
| CF-X2 | “Copper Cooling Fins “”XL””: Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.” |
| CF-X3 | “Copper Cooling Fins “”XXL””: Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.” |
| CF-CS | Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1 |
| CF-LC | Copper Cooling Fins for liquid cooling: Double fins |
| CF-D | Double Copper Cooling Fins: Approx. 100% more cooling power |
| CF-S | Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D |
| CF-GRA | Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer |
| CF-CER | Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm. |
| CCS | Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended. |
| CCF | Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation. |
| GCF | Grounded Cooling Flange: Cooling by a grounded base plate made of nickel plated copper. For medium power. Increased coupling capacitance. Isolation voltage up to 50 kVDC. |
| GCF-X2 | Grounded Cooling Flange |
| GCF-W | Water Cooler for Grounded Cooling Flange: Flat water cooling plate attached to the grounded cooling flange GCF. With water inlet and outlet. |
| DLC | Direct Liquid Cooling: Internal liquid channel in direct contact with the power semiconductors. Very compact cooling solution for medium power. Non-conductive liquids only. |
| HI-REL | High Reliability / MIL Versions: Available on request. |