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HV switch, variable on-time, low on-resistance, SiC & Trench FET

The solid-state switches have extreme rise and fall times. If your application does not require the full switching speed we suggest you the use of the speed limiting option S-TT (rise & fall times slower by approx. 50%) in combination with the input low pass filter option LP. The speed limiting options help to minimize the high frequency difficulties typical for fast high voltage pulse circuits (e.g. self oscillating, self re-triggering, ringing etc.) and simplify the EMC design in general.

Features:

Extremely low on-resistance
Robust regarding overload and voltage reversal
Low dynamic switching losses, extremely low turn-on losses

Application Note

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Products

Silicon Carbide (SiC) switches in LC2 technology. Robust and transient proof. In many cases no need for extra cooling measures thanks to extremely low on-resistance.


Switch Model	Max. Voltage (kV)	Peak Current (A)	Peak Power (MW)	On-Resist. (Ω)	On-Time (ns)	Housing Dimensions (mm3 )	Datasheet
HTS 61-15-SiC	6	150	0.9	0.24	120…∞	103 x 70 x 35
HTS 61-30-SiC	6	300	1.8	0.12	120…∞	103 x 70 x 35
HTS 61-60-SiC	6	600	3.6	0.06	120…∞	115 x 75 x 75
HTS 61-120-SiC	6	1200	7.2	0.03	120…∞	175 x 75 x 75
HTS 121-15-SiC	12	150	1.8	0.48	120…∞	103 x 70 x 35
HTS 121-30-SiC	12	300	3.6	0.24	120…∞	103 x 70 x 35
HTS 121-60-SiC	12	600	7.2	0.12	120…∞	115 x 75 x 75
HTS 121-120-SiC	12	1200	14.4	0.06	120…∞	175 x 100 x 75
HTS 121-180-SiC	12	1800	21.6	0.04	120…∞	240 x 150 x 80
HTS 121-360-SiC	12	3600	43.2	0.02	120…∞	240 x 150 x 150
HTS 151-15-SiC	15	150	2.25	0.56	120…∞	175 x 75 x 56
HTS 151-30-SiC	15	300	4.5	0.28	120…∞	175 x 75 x 56
HTS 151-60-SiC	15	600	9	0.14	120…∞	125 x 125 x 75
HTS 151-120-SiC	15	1200	18	0.07	120…∞	175 x 125 x 75
HTS 151-180-SiC	15	1800	27	0.047	120…∞	240 x 125 x 80
HTS 151-360-SiC	15	3600	54	0.023	120…∞	240 x 125 x 150
HTS 201-15-SiC	20	150	3	0.8	150…∞	200 x 75 x 56
HTS 201-30-SiC	20	300	6	0.4	150…∞	200 x 75 x 56
HTS 201-60-SiC	20	600	12	0.2	150…∞	200 x 150 x 56
HTS 201-120-SiC	20	1200	24	0.1	150…∞	200 x 150 x 80
HTS 201-180-SiC	20	1800	36	0.067	150…∞	252 x 175 x 80
HTS 201-240-SiC	20	2400	48	0.05	150…∞	312 x 175 x 80
HTS 201-300-SiC	20	3000	60	0.04	150…∞	372 x 175 x 80
HTS 201-600-SiC	20	6000	120	0.02	150…∞	372 x 175 x 150
HTS 241-15-SiC	24	150	3.6	0.96	200…∞	252 x 75 x 56
HTS 241-30-SiC	24	300	7.2	0.48	200…∞	252 x 75 x 56
HTS 241-60-SiC	24	600	14.4	0.24	200…∞	252 x 175 x 56
HTS 241-120-SiC	24	1200	28.8	0.12	200…∞	200 x 175 x 80
HTS 241-180-SiC	24	1800	43.2	0.08	200…∞	252 x 175 x 80
HTS 241-240-SiC	24	2400	57.6	0.06	200…∞	312 x 175 x 80
HTS 241-300-SiC	24	3000	72	0.048	200…∞	372 x 175 x 80
HTS 241-600-SiC	24	6000	144	0.024	200…∞	372 x 175 x 150
HTS 301-15-SiC	30	150	4.5	1.12	200…∞	275 x 75 x 58
HTS 301-30-SiC	30	300	9	0.56	200…∞	275 x 75 x 58
HTS 301-60-SiC	30	600	18	0.28	200…∞	275 x 150 x 58
HTS 301-120-SiC	30	1200	36	0.14	200…∞	225 x 225 x 80
HTS 301-180-SiC	30	1800	54	0.093	200…∞	252 x 225 x 80
HTS 301-240-SiC	30	2400	72	0.07	200…∞	312 x 225 x 80
HTS 301-300-SiC	30	3000	90	0.056	200…∞	372 x 225 x 80
HTS 301-600-SiC	30	6000	180	0.028	200…∞	372 x 225 x 150
HTS 401-15-SiC	40	150	6	1.44	200…∞	350 x 75 x 58
HTS 401-30-SiC	40	300	12	0.72	200…∞	350 x 75 x 58
HTS 401-60-SiC	40	600	24	0.36	200…∞	350 x 150 x 58
HTS 401-120-SiC	40	1200	48	0.18	200…∞	350 x 150 x 80
HTS 401-180-SiC	40	1800	72	0.12	200…∞	312 x 300 x 80
HTS 401-240-SiC	40	2400	96	0.09	200…∞	372 x 300 x 80
HTS 401-300-SiC	40	3000	120	0.072	200…∞	432 x 300 x 80
HTS 401-600-SiC	40	6000	240	0.036	200…∞	432 x 300 x 150
HTS 501-15-SiC	50	150	7.5	1.76	250…∞	252 x 150 x 58
HTS 501-30-SiC	50	300	15	0.88	250…∞	252 x 200 x 58
HTS 501-60-SiC	50	600	30	0.44	250…∞	372 x 150 x 58
HTS 501-120-SiC	50	1200	60	0.22	250…∞	372 x 300 x 58
HTS 501-240-SiC	50	2400	120	0.11	250…∞	372 x 300 x 90
HTS 501-480-SiC	50	4800	240	0.055	250…∞	372 x 300 x 160
HTS 701-15-SiC	70	150	10.5	2.4	250…∞	312 x 150 x 58
HTS 701-30-SiC	70	300	21	1.2	250…∞	312 x 200 x 58
HTS 701-60-SiC	70	600	42	0.6	250…∞	492 x 200 x 58
HTS 701-120-SiC	70	1200	84	0.3	250…∞	492 x 200 x 80
HTS 701-180-SiC	70	1800	126	0.2	250…∞	492 x 300 x 58
HTS 701-240-SiC	70	2400	168	0.15	250…∞	492 x 200 x 150
HTS 901-15–SiC	90	150	13.5	3.4	250…∞	372 x 150 x 68
HTS 901-30-SiC	90	300	27	1.52	250…∞	372 x 200 x 68
HTS 901-60-SiC	90	600	54	0.76	250…∞	552 x 200 x 68
HTS 901-120-SiC	90	1200	108	0.38	250…∞	552 x 200 x 90
HTS 901-180-SiC	90	1800	162	0.253	250…∞	552 x 250 x 90
HTS 1001-15-SiC	100	150	15	3.36	250…∞	432 x 150 x 68
HTS 1001-30-SiC	100	300	30	1.68	250…∞	432 x 200 x 68
HTS 1001-60-SiC	100	600	60	0.84	250…∞	612 x 150 x 68
HTS 1001-120-SiC	100	1200	120	0.42	250…∞	612 x 200 x 90
HTS 1001-180-SiC	100	1800	180	0.28	250…∞	612 x 250 x 90
HTS 1201-15-SiC	120	150	18	4	250…∞	552 x 150 x 68
HTS 1201-30-SiC	120	300	36	2	250…∞	552 x 200 x 68
HTS 1201-60-SiC	120	600	72	1	250…∞	552 x 200 x 90
HTS 1201-120-SiC	120	1200	144	0.5	250…∞	552 x 250 x 90
HTS 1401-15-SiC	140	150	21	4.8	250…∞	672 x 150 x 68
HTS 1401-30-SiC	140	300	42	2.4	250…∞	672 x 200 x 68
HTS 1401-60-SiC	140	600	84	1.2	250…∞	672 x 250 x 90
HTS 1401-120-SiC	140	1200	168	0.6	250…∞	672 x 300 x 90
HTS 1601-15-SiC	160	150	24	5.44	250…∞	672 x 150 x 68
HTS 1601-30-SiC	160	300	48	2.72	250…∞	672 x 200 x 68
HTS 1601-60-SiC	160	600	96	1.36	250…∞	672 x 250 x 90
HTS 1601-120-SiC	160	1200	192	0.68	250…∞	672 x 300 x 90

Trench FET


Switch Model	Max. Voltage (kV)	Peak Current (A)	Peak Power (MW)	On-Resist. (Ω)	On-Time (ns)	Housing Dimensions (mm3 )	Datasheet
HTS 051-120-B	0.5	1200	0.6	0.01	150…∞	89 x 64 x 27
HTS 051-260-B	0.5	2600	1.3	0.005	150…∞	89 x 64 x 27
HTS 31-12-B	3	125	0.375	0.5	150…∞	89 x 64 x 27
HTS 31-125-B	3.6	1250	4.5	0.06	300…∞	200 x 76 x 26
HTS 31-250-B	3.6	2500	9	0.03	300…∞	252 x 200 x 45
HTS 31-375-B	3.6	3750	13.5	0.02	350…∞	312 x 200 x 45
HTS 61-12-B	6	125	0.75	1	150…∞	89 x 64 x 27
HTS 61-25-B	6	250	1.5	0.5	180…∞	115 x 64 x 27
HTS 71-62-B	7.2	625	4.5	0.24	300…∞	200 x 76 x 26
HTS 71-125-B	7.2	1250	9	0.12	300…∞	252 x 200 x 45
HTS 71-187-B	7.2	1875	13.5	0.08	350…∞	312 x 200 x 45
HTS 81-12-B	8.4	125	1.5	1.4	150…∞	135 x 64 x 27
HTS 81-25-B	8.4	250	2.1	0.7	180…∞	135 x 64 x 27
HTS 101-12-B	10.8	125	1.35	1.8	200…∞	206 x 70 x 35
HTS 101-25-B	10.8	250	2.7	0.9	250…∞	206 x 70 x 35
HTS 101-125-B	10.8	1250	13.5	0.18	350…∞	312 x 200 x 45
HTS 121-30-B	12	300	3.6	0.8	300…∞	153 x 102 x 25
HTS 141-62-B	14.4	625	9	0.48	300…∞	252 x 200 x 45
HTS 151-12-B	15	125	1.875	2.4	200…∞	212 x 70 x 35
HTS 151-25-B	15	250	3.75	1.2	250…∞	212 x 70 x 35
HTS 181-12-B	18	125	2.25	3	200…∞	263 x 70 x 35
HTS 181-25-B	18	250	4.5	1.5	250…∞	263 x 70 x 35
HTS 211-12-B	21.6	125	2.7	3.4	200…∞	263 x 70 x 35
HTS 211-25-B	21.6	250	5.4	1.7	200…∞	263 x 70 x 35
HTS 211-62-B	21.6	625	13.5	0.72	350…∞	312 x 200 x 45

Options


Options	Description
B-CON	Beginner’s Configuration: The standard switch is equipped with various options to simplify first time experiments for users which are inexperienced with high voltage and high frequency circuit design. The beginner’s configuration includes option FH and PT-HV for easy wiring and attachment without printed circuit boards

HFB	High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.
HFS	High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2)
LP	Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3)
FAST	Faster Switching Times (-30 to -40%) due to increased driver power. Minimum on-times will be reduced by about 40 to 50%. For selected high current switches only. Please consult factory. (2)
S-ON	Soft Turn-On: “Turn-On Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
S-OFF	Soft Turn-Off: “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
S-TT	Soft Transition Time: ”Turn-On Rise Time” & “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
MIN-ON	Minimum On-Time: Individually increased Minimum On-Time to ensure a minimum on duration indepently of control signal. For safety relevant circuits.
MIN-OFF	Minimum Off-Time: Individually increased Minimum Off-Time to ensure a minimum off duration indepently of control signal. For safety relevant circuits.
ST	Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).
LNC	Low Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f).
LL	Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series.
LN	Low Noise: Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP applications) only.(2)
ISO-25	25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models.
ISO-40	40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
ISO-80	80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
ISO-120	120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
PL	Passive Lock: Special inhibit function for two single switches in fast push-pull circuits. The input of the passive switch will be locked by the activated switch to avoid turn-on by noise.
I-PC	Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
I-FWD	Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only.
I-FWDN	Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only.
SPT-C	Shielded Pigtail for Control Connection: Cable (l=300mm
PT-C	Pigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. Recommended for modules with options CF & GCF.
PIN-C	Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.
PT-HV	Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.
ST-HV	Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.
SEP-C	Separated Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.
FOI-I	Fibre Optics Input / Inhibit: Additional optical inhibit input to turn-off the switch by using the inhibit input with a fibre-optical signal (only in combination with option SEP-C) (2)
FOI-C	Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)
FOO-F	Fibre Optical Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2)
UL94	Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
FH	Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.
TH	Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2)
FC	Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF
ITC	Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)
CF	Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.
CF-1	Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).
CF-X2	“Copper Cooling Fins “”XL””: Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.”
CF-X3	“Copper Cooling Fins “”XXL””: Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.”
CF-CS	Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1
CF-LC	Copper Cooling Fins for liquid cooling: Double fins
CF-D	Double Copper Cooling Fins: Approx. 100% more cooling power
CF-S	Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D
CF-GRA	Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer
CF-CER	Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.
CCS	Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.
CCF	Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DR	Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
GCF	Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC.
GCF-X2	Grounded Cooling Flange
ILC	Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.
DLC	Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.
HI-REL	High Reliability / MIL Versions: Available on request. (2)

[1]	New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.
[2]	Please consult factory for detailed information.
[3]	These options are EMC-relevant and are recommended for industrial power applications

HV switch, variable on-time, low on-resistance, SiC & Trench FET

Silicon Carbide (SiC) switches in LC2 technology. Robust and transient proof. In many cases no need for extra cooling measures thanks to extremely low on-resistance.

Trench FET

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