Laboratory pulser & OEM pulser units

Features:

  • HV switches in pulser configuration
  • Ready for use
  • No external components required
  • Laboratory pulsers are always CE certified
  • All pulsers optimized for system integration

GHTS Series, pulser for the laboratory use.

Switch ModelMax. Voltage (kV)Peak Current (A)HV Pulse Width (ns)Housing Dimensions (mm3 )Datasheet
GHTS 30 2 x 3 2 x 30 100…∞ 170 x 110 x 45
GHTS 30 A 2 x 3 2 x 60 100…∞ 170 x 110 x 45
GHTS 60 2 x 6 2 x 15 100…∞ 170 x 110 x 45
GHTS 60 A 2 x 6 2 x 30 100…∞ 210 x 110 x 45
GHTS 60 B 2 x 6 2 x 60 100…∞210 x 110 x 45
GHTS 100 2 x 10 2 x 15 100…∞ 210 x 110 x 45
GHTS 100 A 2 x 10 2 x 30 100…∞ 210 x 110 x 45

FSWP Series, Fast Square Wave Pulser, for system integration.

Switch ModelMax. Voltage (kV)Peak Current (A)HV Pulse Width (ns)Housing Dimensions (mm3 )Datasheet
FSWP 51-02 5.42550 ns…∞  175 x 80 x 45
FSWP 71-02 7.22050 ns…∞  175 x 80 x 45
FSWP 91-01 91550 ns…∞  175 x 80 x 45

FQD Series, Fast Q-Switch Pockels Cell Driver, for system integration.

Switch ModelMax. Voltage (kV)Peak Current (A)HV Pulse Width (Depends on R x C)Housing Dimensions (mm3 )Datasheet
FQD-30-04-C340100 ns…1 ms64 x 30 x 18
FQD 30-08-UF 380100 ns…1 ms 79 x 38 x 19
FQD 30-06-UF 3.660100 ns…1 ms79 x 38 x 19
FQD-40-02-C420100 ns…1 ms64 x 30 x 18
FQD-40-03-C430100 ns…1 ms64 x 30 x 18
FQD 40-03 435100 ns…1 ms 79 x 38 x 19
FQD 40-06 460100 ns…1 ms 79 x 38 x 19
FQD-50-02-C520100 ns…1 ms64 x 30 x 18
FQD 50-02 525100 ns…1 ms 79 x 38 x 19
FQD 50-05 550100 ns…1 ms 79 x 38 x 19
FQD 60-02 620100 ns…1 ms 79 x 38 x 19
FQD-60-03-C630100 ns…1 ms64 x 30 x 18
FQD 60-04 640100 ns…1 ms 79 x 38 x 19
FQD 80-01 815100 ns…1 ms 79 x 38 x 19
FQD-80-02-C825100 ns…1 ms64 x 30 x 18
FQD 80-03 830100 ns…1 ms 79 x 38 x 19

DSM Series, Differential Switch Mode Pulser, for system integration.

Switch ModelMax. Voltage (kV)Peak Current (A)HV Pulse Width (Depends on R x C)Housing Dimensions (mm3 )Datasheet
DSM 31-033304 ns - ∞    102 x 76 x 20
DSM 31-02 3.6255 ns - ∞    102 x 76 x 20
DSM 61-016155 ns - ∞    102 x 76 x 20
DSM 91-01 91210 ns - ∞   102 x 76 x 20

FHPP Series, Fast High-Voltage Precision Pulser.

Switch ModelMax. Voltage (kV)Peak Current (A)HV Pulse Width (ns)Housing Dimensions (mm3 )Datasheet
FHPP 602 x  62 x 8060…∞ 184 x 105 x 92
FHPP 80 2 x 82 x 6060…∞ 184 x 105 x 92
FHPP 100 2 x 102 x 5060…∞ 184 x 105 x 92
FHPP 120 2 x 122 x 3060…∞184 x 105 x 92

Options for the GHTS series:

Description
Option 01Protective Series Resistor 200 Ohm. 
Option 02Built-in Miniature Fan
Option 03Improved thermal conductivity of the internal switching module by means of an internal ceramic cooling surface

Options for the FSWP Series

OptionsDescription
ALL-OFF"Voltage free pulse output in case of fault or if inhibit is ""L"". Suggested in circuits with positive and negative supply. A pull down-resistor may be required to keep the opened switches potential-free. "
FL-INFloating High Voltage Inputs
I-PCIntegrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
UL94Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
CF-LCCopper Cooling Fins for liquid cooling: Double fins
CCFCeramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DRCooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
ILCIndirect Liquid Cooling:  Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.
DLCDirect Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.

Options for the FQD Series

OptionsDescription
HFSHigh Frequency Switching: External supply of auxiliary driver voltage. Necessary if the specified “Max. Operating Frequency” shall be exceeded. (2)
I-PCIntegrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
PT-CPigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins.
PIN-CPins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). Only relevant for switching modules which have pigtails as standard.
UL94Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
THTubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. (2)
FCFlat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF
ITCIncreased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)
CFCopper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.
CF-1Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).
CF-X2"Copper Cooling Fins ""XL"": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-X3"Copper Cooling Fins ""XXL"": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-CSCopper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1
CF-LCCopper Cooling Fins for liquid cooling: Double fins
CF-DDouble Copper Cooling Fins: Approx. 100% more cooling power
CF-SCopper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D
CF-GRANon-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer
CF-CERIsolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.
CCSCeramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.
CCFCeramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DRCooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
GCFGrounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC.
GCF-X2Grounded Cooling Flange
ILCIndirect Liquid Cooling:  Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.
DLCDirect Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.
HI-RELHigh Reliability / MIL Versions:  Available on request. (2)

Options for the DSM Series

OptionDescription
HFSHigh Frequency Switching: External supply of auxiliary driver voltage. Necessary if the specified “Max. Operating Frequency” shall be exceeded. (2)
I-PCIntegrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
PT-CPigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins.
PIN-CPins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). Only relevant for switching modules which have pigtails as standard.
UL94Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
THTubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. (2)
FCFlat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF
ITCIncreased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)
CFCopper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.
CF-1Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).
CF-X2"Copper Cooling Fins ""XL"": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-X3"Copper Cooling Fins ""XXL"": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-CSCopper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1
CF-LCCopper Cooling Fins for liquid cooling: Double fins
CF-DDouble Copper Cooling Fins: Approx. 100% more cooling power
CF-SCopper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D
CF-GRANon-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer
CF-CERIsolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.
CCSCeramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.
CCFCeramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DRCooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
GCFGrounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC.
GCF-X2Grounded Cooling Flange
ILCIndirect Liquid Cooling:  Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.
DLCDirect Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.
HI-RELHigh Reliability / MIL Versions:  Available on request. (2)
[1]New option code:  Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.   
[2]Please consult factory for detailed information.
[3]These options are EMC-relevant and are recommended for industrial power applications