C9 variable on-time, bidirectional (AC) push-pull, MOSFET / HVP

Features:

No cross-over current
No working resistor required
Rise and fall time identical

Application Note

Switch Model	Max. Voltage (kV)	Peak Current (A)	On-Resist. (Ω)	On-Time (ns)	Housing Dimensions (mm3 )
HTS 31-03-HB-AC-C	2 x 3	2 x 30	2 x 10	70…∞	125 x 38 x 17
HTS 31-13-HB-B-AC-C	2 x 3.6	2 x 130	2 x 1	180…∞	125 x 38 x 17
HTS 41-02-HB-LC-AC-C	2 x 3.6	2 x 25	2 x 15	70…∞	125 x 38 x 17
HTS 61-01-HB-AC-C	2 x 6	2 x 15	2 x 44	70…∞	125 x 38 x 17
HTS 91-01-HB-AC-C	2 x 9	2 x 12	2 x 84	70…∞	125 x 38 x 20

Switch Model

Max. Voltage (kV)

Peak Current (A)

On-Resist. (Ω)

On-Time (ns)

Housing Dimensions (mm3 )

Datasheet

HTS 31-03-HB-AC-C

2 x 3

2 x 30

2 x 10

70…∞

125 x 38 x 17

HTS 31-13-HB-B-AC-C

2 x 3.6

2 x 130

2 x 1

180…∞

125 x 38 x 17

HTS 41-02-HB-LC-AC-C

2 x 3.6

2 x 25

2 x 15

70…∞

125 x 38 x 17

HTS 61-01-HB-AC-C

2 x 6

2 x 15

2 x 44

70…∞

125 x 38 x 17

HTS 91-01-HB-AC-C

2 x 9

2 x 12

2 x 84

70…∞

125 x 38 x 20

Switch Model	Max. Voltage (kV)	Peak Current (A)	On-Resist. (Ω)	On-Time (ns)	Housing Dimensions (mm3 )
HTS 81-10-GSM-AC	2 x 8	2 x 100	2 x 3	150…∞	150 x 150 x 58
HTS 121-10-GSM-AC	2 x 12	2 x 100	2 x 5	180…∞	200 x 150 x 68
HTS 151-10-GSM-AC	2 x 15	2 x 100	2 x 6	180…∞	200 x 150 x 68
HTS 201-10-GSM-AC	2 x 20	2 x 100	2 x 8	180…∞	225 x 150 x 68
HTS 241-10-GSM-AC	2 x 24	2 x 100	2 x 12	200…∞	250 x 150 x 68
HTS 301-10-GSM-AC	2 x 30	2 x 100	2 x 14	200…∞	300 x 150 x 68
HTS 401-10-GSM-AC	2 x 40	2 x 100	2 x 18	250…∞	372 x 150 x 70
HTS 501-10-GSM-AC	2 x 50	2 x 100	2 x 22	250…∞	432 x 150 x 70
HTS 651-10-GSM-AC	2 x 65	2 x 100	2 x 28	300…∞	372 x 350 x 70
HTS 701-10-GSM-AC	2 x 70	2 x 100	2 x 30	300…∞	375 x 350 x 70
HTS 901-10-GSM-AC	2 x 90	2 x 100	2 x 32	300...∞	432 x 350 x 70
HTS 1201-10-GSM-AC	2 x 120	2 x 100	2 x 42	300...∞	512 x 350 x 70
HTS 1401-10-GSM-AC	2 x 140	2 x 100	2 x 52	300…∞	672 x 350 x 90

Switch Model

Max. Voltage (kV)

Peak Current (A)

On-Resist. (Ω)

On-Time (ns)

Housing Dimensions (mm3 )

Datasheet

HTS 81-10-GSM-AC

2 x 8

2 x 100

2 x 3

150…∞

150 x 150 x 58

HTS 121-10-GSM-AC

2 x 12

2 x 100

2 x 5

180…∞

200 x 150 x 68

HTS 151-10-GSM-AC

2 x 15

2 x 100

2 x 6

180…∞

200 x 150 x 68

HTS 201-10-GSM-AC

2 x 20

2 x 100

2 x 8

180…∞

225 x 150 x 68

HTS 241-10-GSM-AC

2 x 24

2 x 100

2 x 12

200…∞

250 x 150 x 68

HTS 301-10-GSM-AC

2 x 30

2 x 100

2 x 14

200…∞

300 x 150 x 68

HTS 401-10-GSM-AC

2 x 40

2 x 100

2 x 18

250…∞

372 x 150 x 70

HTS 501-10-GSM-AC

2 x 50

2 x 100

2 x 22

250…∞

432 x 150 x 70

HTS 651-10-GSM-AC

2 x 65

2 x 100

2 x 28

300…∞

372 x 350 x 70

HTS 701-10-GSM-AC

2 x 70

2 x 100

2 x 30

300…∞

375 x 350 x 70

HTS 901-10-GSM-AC

2 x 90

2 x 100

2 x 32

300...∞

432 x 350 x 70

HTS 1201-10-GSM-AC

2 x 120

2 x 100

2 x 42

300...∞

512 x 350 x 70

HTS 1401-10-GSM-AC

2 x 140

2 x 100

2 x 52

300…∞

672 x 350 x 90

Option	Description
B-CON	Beginner's Configuration: The standard switch is equipped with various options to simplify first time experiments for users
HFB	High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.
HFS	High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2)
LP	Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3)
S-TT	Soft Transition Time: ”Turn-On Rise Time” & “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
LNC	Low Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f).
LL	Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series.
LN	Low Noise: Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP applications) only. (2)
ALL-OFF	"Voltage free pulse output in case of fault or if inhibit is ""L"". Suggested in circuits with positive and negative supply. A pull down-resistor may be required to keep the opened switches potential-free. "
ISO-25	25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models.
ISO-40	40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
ISO-80	80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
ISO-120	120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
ISO-200	200 kV Isolation: Isolation Voltage increased to 200 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
I-PC	Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
PCC	Pulser Configuration. Switch combined with custom specific part components. Integrated in a flange housing with hv connectors according to the customers specifications. (2)
I-FWD	Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only.
I-FWDN	Integrated Free-Wheeling Diode Network:Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only.
LS-C	LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. For improved noise immunity. (3)
PT-C	Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-modu plug. Refers to switching modules with pins only. Suggested for modules with options CF & GCF.
PT-HV	Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not for extremely fast circuits.
ST-HV	Screw Terminals for HV Connection: Threaded inserts at the bottom of module for PCB attachment. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.
SEP-C	Separated Control Unit: Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.
FOI-I	Fibre Optics Input / Inhibit: Additional optical inhibit input to turn-off the switch by using the inhibit input with a fibre-optical signal (only in combination with option SEP-C) (2)
FOI-C	Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)
FOO-F	Fibre Optical Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2)
UL94	Flame Retardant Casting Resin:Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
FH	Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.
TH	Tubular Housing:Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2)
FC	Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF
ITC	Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)
CF	Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.
CF-1	Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).
CF-X2	"Copper Cooling Fins ""XL"": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-X3	"Copper Cooling Fins ""XXL"": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-CS	Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1
CF-LC	Copper Cooling Fins for liquid cooling: Double fins
CF-D	Double Copper Cooling Fins: Approx. 100% more cooling power
CF-S	Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D
CF-GRA	Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer
CF-CER	Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.
CCS	Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.
CCF	Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DR	Cooling for Driver:Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
GCF	Grounded Cooling Flange:Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC.
GCF-X2	Grounded Cooling Flange
ILC	Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.
DLC	Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.
HI-REL	High Reliability / MIL Versions:High Reliability / MIL Versions: Available on request. (2)

[1]	New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.
[2]	Please consult factory for detailed information.
[3]	These options are EMC-relevant and are recommended for industrial power applications

Option

Description

B-CON

Beginner's Configuration: The standard switch is equipped with various options to simplify first time experiments for users

HFB

High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.

HFS

High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2)

Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3)

S-TT

Soft Transition Time: ”Turn-On Rise Time” & “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)

LNC

Low Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f).

Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series.

Low Noise: Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP applications) only. (2)

ALL-OFF

"Voltage free pulse output in case of fault or if inhibit is ""L"". Suggested in circuits with positive and negative supply. A pull down-resistor may be required to keep the opened switches potential-free. "

ISO-25

25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models.

ISO-40

40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

ISO-80

80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

ISO-120

120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

ISO-200

200 kV Isolation: Isolation Voltage increased to 200 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.

I-PC

Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors

PCC

Pulser Configuration. Switch combined with custom specific part components. Integrated in a flange housing with hv connectors according to the customers specifications. (2)

I-FWD

Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only.

I-FWDN

Integrated Free-Wheeling Diode Network:Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only.

LS-C

LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. For improved noise immunity. (3)

PT-C

Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-modu plug. Refers to switching modules with pins only. Suggested for modules with options CF & GCF.

PT-HV

Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not for extremely fast circuits.

ST-HV

Screw Terminals for HV Connection: Threaded inserts at the bottom of module for PCB attachment. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.

SEP-C

Separated Control Unit: Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.

FOI-I

Fibre Optics Input / Inhibit: Additional optical inhibit input to turn-off the switch by using the inhibit input with a fibre-optical signal (only in combination with option SEP-C) (2)

FOI-C

Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)

FOO-F

Fibre Optical Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2)

UL94

Flame Retardant Casting Resin:Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)

Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.

Tubular Housing:Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2)

Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF

ITC

Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)

Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.

CF-1

Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).

CF-X2

"Copper Cooling Fins ""XL"": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."

CF-X3

"Copper Cooling Fins ""XXL"": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."

CF-CS

Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1

CF-LC

Copper Cooling Fins for liquid cooling: Double fins

CF-D

Double Copper Cooling Fins: Approx. 100% more cooling power

CF-S

Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D

CF-GRA

Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer

CF-CER

Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.

CCS

Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.

CCF

Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.

C-DR

Cooling for Driver:Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)

GCF

Grounded Cooling Flange:Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC.

GCF-X2

Grounded Cooling Flange

ILC

Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.

DLC

Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.

HI-REL

High Reliability / MIL Versions:High Reliability / MIL Versions: Available on request. (2)

[1]

New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.

[2]

Please consult factory for detailed information.

[3]

These options are EMC-relevant and are recommended for industrial power applications

HV switch, variable on-time, bidirectional (AC) push-pull, MOSFET

Compact Series. Low self inductance & very short transition times. Good transient immunity.

Power Series. Robust and transient proof due to LC2 technology. For high capacitive, resistive & inductive load.

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