HV switches fixed on-time, high di/dt, ultra fast, MOSFET

HV switch with extremely fast turn-on rise time. True gate control (no avalanche technique) for highest reliability over a wide range of operating temperatures and load conditions. Designed for attachment on printed circuit boards (PCB)

Features:

  • Very low impedance
  • Very EMC tolerant
  • Available with on-time options from 5 ns to 1 μs

Application Note

Switch ModelMax. Voltage (kV)Peak Current (A)On-Resist. (Ω)On-Time (ns)Housing Dimensions (mm3 )Datasheet
HTS 30-08-UF 380 2.512080 x 38 x 25
HTS 30-06-UF 3.660 3.612080 x 38 x 25
HTS 50-08-UF 580420089 x 64 x 31
HTS 50-12-UF 5120320089 x 64 x 31
HTS 80-12-UF 8120 4.5200122 x 64 x 31
HTS 80-20-UF 8200 2.6200122 x 89 x 31
HTS 100-20-UF 10200 3.4200150 x 89 x 31
HTS 120-15-UF 12150 4.8200153 x 89 x 31
OptionDescription
HFBHigh Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.
HFSHigh Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2)
LPLow Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps.  Improved noise immunity and  less critical wiring in high speed applications. (3)
OT-5nOn-Time Reduction:  On-Time reduced to 5 ns
OT-10nOn-Time Reduction:  On-Time reduced to 10 ns
OT-20nOn-Time Reduction:  On-Time reduced to 20 ns
OT-PProgrammable On-Time: On-Time adjustable in certain limits by means of external programming resistors. (2)
OT-CCustomized On-Time:  On-Time according to customer’s specifications. Any value between 20 ns and 1 μs. (2)
MIN-PSMinimum Pulse Spacing:  Individually increased Recovery Time to ensure a minimum HV pulse spacing indepently of control pulse spacing. For safety relevant circuits.
STStage Tapping:  Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).
LNCLow Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage..
LLLow Leakage Current: Off-state current reduced to less than 10%  of the specified value. Not available in connection with the cooling fin options and for switches of the UF series.
ISO-2525 kV Isolation:  Isolation Voltage increased to  25 kVDC. Housing dimensions may change for some models.
ISO-4040 kV Isolation:  Isolation Voltage increased to  40 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.
ISO-8080 kV Isolation:  Isolation Voltage increased to  80 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.
I-PCIntegrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
I-FWDIntegrated Free-Wheeling Diode:  Built-in parallel diode with short recovery time. In connection with inductive load only.
I-FWDNIntegrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode  with short recovery time. In connection with inductive load only.
SEP-CSeparate Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails
FOI-CFibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)
FOO-FFibre Optics Output / Fault: Additional optical output to read-out the failure condition of the switch by means of a fibre-optical signal (only in combination with option SEP-C) (2)
I-PCIntegrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
LS-CLEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3)
PT-CPigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. Recommended for modules with options CF & GCF.
PIN-CPins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.
PT-HVPigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.
ST-HVScrew Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.
UL94Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
FHFlange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.
THTubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. ‚
FCFlat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF
ITCIncreased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)
CFCopper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.
CF-1Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).
CF-X2"Copper Cooling Fins ""XL"": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-X3"Copper Cooling Fins ""XXL"": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-CSCopper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1
CF-LCCopper Cooling Fins for liquid cooling: Double fins
CF-DDouble Copper Cooling Fins: Approx. 100% more cooling power
CF-SCopper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D
CF-GRANon-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer
CF-CERIsolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.
CCSCeramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.
CCFCeramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DRCooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
GCFGrounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance Cc.
GCF-X2Grounded Cooling Flange
ILCIndirect Liquid Cooling:  Liquid cooling for all kind of conductive coolants including mains water. Internal heat exchanger made of ceramics. For medium power applications.
DLCDirect Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling solution especally for high frequency applications. For non-conductive coolants only.
HI-RELHigh Reliability / MIL Versions:  Available on request. (2)
[1]New option code:  Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.   
[2]Please consult factory for detailed information.
[3]These options are EMC-relevant and are recommended for industrial power applications