HV switches variable on-time, general purpose, MOSFET

Versatile and cost-efficient HV switch with true relay character. Negligible dynamic switching losses due to fast transistion time. Excellent dv/dt immunity against HV transients

Features:

  • On-time controllable by TTL signal
  • Robust regarding overload and voltage reversal
  • Very compact and lightweight design

Application Note

Compact series. Prefered in applications with requirements on small build volume and low stray inductance.

Switch ModelMax. Voltage (kV)Peak Current (A)On-Resist. (Ω)On-Time (ns)Housing Dimensions (mm3 )Datasheet
HTS 11-14-C 1.2140 1.250…∞ 79 x 38 x 17
HTS 21-07-C 2.470 2.450…∞ 79 x 38 x 17
HTS 31-06-C 360550…∞ 79 x 38 x 17
HTS 31-05-C 3.650750…∞ 79 x 38 x 17
HTS 41-05-C 4.850650…∞ 79 x 38 x 17
HTS 61-03-C 6301050…∞ 79 x 38 x 17
HTS 61-06-C 664 5.275…∞ 175 x 50 x 30
HTS 71-02-LC-C 7.2251450…∞ 79 x 38 x 17
HTS 91-02-C 9.6251250…∞ 79 x 38 x 17
HTS 91-05-C 9.650680…∞ 125 x 38 x 17
HTS 101-02-LC-C 10.8252180…∞ 125 x 38 x 17
HTS 121-01-C 12154850…∞ 79 x 38 x 17
HTS 121-03-C 12322175…∞ 175 x 50 x 30
HTS 181-01-C 18126050…∞ 79 x 38 x 17
HTS 181-02-C 18243675…∞ 175 x 50 x 30
HTS 241-01-C 241512075…∞ 175 x 50 x 30
HTS 361-01-C 361212075…∞175 x 50 x 30

Standard series. Prefered in applications with higher requirements on cooling power and isolation voltage.

Switch ModelMax. Voltage (kV)Peak Current (A)On-Resist. (Ω)On-Time (ns)Housing Dimensions (mm3 )Datasheet
HTS 051-64 0.56400.043 100…∞ 89 x 64 x 27
HTS 11-30 13200.17 100…∞ 89 x 64 x 27
HTS 21-14 21401100…∞ 89 x 64 x 27
HTS 21-50 25000.3 200… ∞ 178 x 64 x 27
HTS 31-06 3603100…∞ 89 x 64 x 27
HTS 41-03 4308100…∞ 89 x 64 x 22.5
HTS 51-06 5605100…∞ 89 x 64 x 27
HTS 51-20 5200 1.2200… ∞ 178 x 64 x 27
HTS 61-03 63012100…∞ 89 x 64 x 22.5
HTS 61-02 6251250…∞ 89 x 64 x 22.5
HTS 61-05 6506100…∞ 89 x 64 x 22.5
HTS 71-06 7606120… ∞ 135 x 64 x 27
HTS 71-12 71203150… ∞ 135 x 64 x 27
HTS 81-09 8905200… ∞ 178 x 64 x 27
HTS 91-06 9608150… ∞ 172 x 70 x 28
HTS 91-12 91204150… ∞ 172 x 70 x 28
HTS 101-0110153650…∞ 89 x 64 x 22.5
HTS 101-03 103018100…∞ 89 x 64 x 22.5
HTS 111-12 11120 4.7150… ∞ 200 x 70 x 28
HTS 141-03 143028150… ∞ 135 x 64 x 27
HTS 141-06 146014150… ∞ 135 x 64 x 27
HTS 151-01 1512 5050…∞ 89 x 64 x 22.5
HTS 151-02 152425100…∞ 89 x 64 x 22.5
HTS 161-03 163034150… ∞ 172 x 70 x 28
HTS 161-06 166017150… ∞ 172 x 70 x 28
HTS 181-06 186017150… ∞ 172 x 70 x 28
HTS 181-12 181208150… ∞ 263 x 70 x 35
HTS 221-03 223044150… ∞ 200 x 70 x 28
HTS 221-06 226022150… ∞ 200 x 70 x 28
HTS 241-06 246022150… ∞ 200 x 70 x 28
HTS 331-03 333055150… ∞ 263 x 70 x 35
HTS 331-06 336027150… ∞ 263 x 70 x 35
HTS 361-06 366027150… ∞263 x 70 x 35
OptionDescription
B-CONBeginners Configuration: The standard switch is equipped with various options to simplify first time experiments for users
MBC"Mechanical Backward Compatibility to the previous switch models. All connectors
HFBHigh Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if > 10 pulses with < 10 μs spacing are generated.
HFSHigh Frequency Switching: Ext. supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Max. Operating Frequency” shall be exceeded. (2)
LPLow Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps.  Improved noise immunity and  less critical wiring. (3)
UFTRUltra Fast Thermotrigger: Advanced temperature protection for the high-voltage switch. Switch shut down within 5 seconds if Pd(max) is exceeded by 300% @ ΔT=25K (50to75°C)
UFTSUltra Fast Thermosensor:Temperature measurement directly on the power semiconductors by means of a special sensor with high electrical isolation and low thermal impedance.
S-ONSoft Turn-On:  “Turn-On Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
S-OFFSoft Turn-Off: “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
S-TTSoft Transition Time: ”Turn-On Rise Time” & “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
TT-CCustomized Transition Time:  Customized rise & fall times to meet individual design requirements. (2)
MIN-ONMinimum On-Time: Individually increased Minimum On-Time to ensure a minimum on duration indepently of control signal.  For safety relevant circuits.
MIN-OFFMinimum Off-Time: Individually increased Minimum Off-Time to ensure a minimum off duration indepently of control signal. For safety relevant circuits.
STStage Tapping:  Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages.
LNCLow Natural Capacitance: CN reduced by approx. 30%. To minimize cap. power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f).
LLLow Leakage Current: Off-state current reduced to less than 10%  of the specified value. Not available in connection with the cooling fin options and for switches of the UF series.
LNLow Noise:  Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP) only. (2)
ISO-2525 kV Isolation:  Isolation Voltage increased to  25 kVDC. Housing dimensions may change for some models.
ISO-4040 kV Isolation:  Isolation Voltage increased to  40 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.
ISO-8080 kV Isolation:  Isolation Voltage increased to  80 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.
ISO-120120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
I-PCIntegrated Part Components: Integration of small part components according to customer’s specifications (e.g. capacitors
PCPulser Configuration. Switch combined with custom specific part components. Integrated in a flange housing with hv connectors according to the customers specifications. (2)
I-FWDIntegrated Free-Wheeling Diode:  Built-in parallel diode with short recovery time. In connection with inductive load only.
I-FWDNIntegrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode  with short recovery time. In connection with inductive load only.
I-TSIntegrated Thermo Sensor: Integrated temperature sensor for external temperature measurements according to customers specifications (NTC
LS-CLEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. For improved noise immunity. (3)
PT-CPigtail for Control Connection: Flexible leads (l=75 mm) with AMP-modu plug. Refers to switching modules with pins only. Suggested for modules with options CF & GCF.
PT-HVPigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not for extremely fast circuits.
ST-HVScrew Terminals for HV Connection: Threaded inserts at the bottom of module for PCB attachment. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.
SEP-CSeparated Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.
FOI-IFibre Optics Input / Inhibit: Additional optical inhibit input to turn-off the switch by using the inhibit input with a fibre-optical signal (only in combination with option SEP-C) (2)
FOI-CFibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)
FOO-FFibre Optical Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2)
UL94Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
FHFlange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.
THTubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. (2)
FCFlat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF
ITCIncreased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)
CFCopper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.
CF-1Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).
CF-X2"Copper Cooling Fins ""XL"": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-X3"Copper Cooling Fins ""XXL"": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-CSCopper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1
CF-LCCopper Cooling Fins for liquid cooling: Double fins
CF-DDouble Copper Cooling Fins: Approx. 100% more cooling power
CF-SCopper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D
CF-GRANon-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer
CF-CERIsolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.
CCSCeramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.
CCFCeramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DRCooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
GCFGrounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC.
ILCIndirect Liquid Cooling:  Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.
DLCDirect Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.
HI-RELHigh Reliability / MIL Versions:  Available on request. (2)
[1]New option code:  Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.   
[2]Please consult factory for detailed information.
[3]These options are EMC-relevant and are recommended for industrial power applications