HV switches variable on-time, general purpose, MOSFET
Versatile and cost-efficient HV switch with true relay character. Negligible dynamic switching losses due to fast transistion time. Excellent dv/dt immunity against HV transients
Features:
- On-time controllable by TTL signal
- Robust regarding overload and voltage reversal
- Very compact and lightweight design
Compact series. Prefered in applications with requirements on small build volume and low stray inductance.
Standard series. Prefered in applications with higher requirements on cooling power and isolation voltage.
| Option | Description |
|---|---|
| B-CON | Beginners Configuration: The standard switch is equipped with various options to simplify first time experiments for users |
| MBC | "Mechanical Backward Compatibility to the previous switch models. All connectors |
| HFB | High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if > 10 pulses with < 10 μs spacing are generated. |
| HFS | High Frequency Switching: Ext. supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Max. Operating Frequency” shall be exceeded. (2) |
| LP | Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring. (3) |
| UFTR | Ultra Fast Thermotrigger: Advanced temperature protection for the high-voltage switch. Switch shut down within 5 seconds if Pd(max) is exceeded by 300% @ ΔT=25K (50to75°C) |
| UFTS | Ultra Fast Thermosensor:Temperature measurement directly on the power semiconductors by means of a special sensor with high electrical isolation and low thermal impedance. |
| S-ON | Soft Turn-On: “Turn-On Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
| S-OFF | Soft Turn-Off: “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
| S-TT | Soft Transition Time: ”Turn-On Rise Time” & “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
| TT-C | Customized Transition Time: Customized rise & fall times to meet individual design requirements. (2) |
| MIN-ON | Minimum On-Time: Individually increased Minimum On-Time to ensure a minimum on duration indepently of control signal. For safety relevant circuits. |
| MIN-OFF | Minimum Off-Time: Individually increased Minimum Off-Time to ensure a minimum off duration indepently of control signal. For safety relevant circuits. |
| ST | Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages. |
| LNC | Low Natural Capacitance: CN reduced by approx. 30%. To minimize cap. power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f). |
| LL | Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series. |
| LN | Low Noise: Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP) only. (2) |
| ISO-25 | 25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models. |
| ISO-40 | 40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
| ISO-80 | 80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
| ISO-120 | 120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
| I-PC | Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. capacitors |
| PC | Pulser Configuration. Switch combined with custom specific part components. Integrated in a flange housing with hv connectors according to the customers specifications. (2) |
| I-FWD | Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only. |
| I-FWDN | Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only. |
| I-TS | Integrated Thermo Sensor: Integrated temperature sensor for external temperature measurements according to customers specifications (NTC |
| LS-C | LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. For improved noise immunity. (3) |
| PT-C | Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-modu plug. Refers to switching modules with pins only. Suggested for modules with options CF & GCF. |
| PT-HV | Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not for extremely fast circuits. |
| ST-HV | Screw Terminals for HV Connection: Threaded inserts at the bottom of module for PCB attachment. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting. |
| SEP-C | Separated Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails. |
| FOI-I | Fibre Optics Input / Inhibit: Additional optical inhibit input to turn-off the switch by using the inhibit input with a fibre-optical signal (only in combination with option SEP-C) (2) |
| FOI-C | Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2) |
| FOO-F | Fibre Optical Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2) |
| UL94 | Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
| FH | Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested. |
| TH | Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2) |
| FC | Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF |
| ITC | Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
| CF | Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants. |
| CF-1 | Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil). |
| CF-X2 | "Copper Cooling Fins ""XL"": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling." |
| CF-X3 | "Copper Cooling Fins ""XXL"": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling." |
| CF-CS | Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1 |
| CF-LC | Copper Cooling Fins for liquid cooling: Double fins |
| CF-D | Double Copper Cooling Fins: Approx. 100% more cooling power |
| CF-S | Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D |
| CF-GRA | Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer |
| CF-CER | Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm. |
| CCS | Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended. |
| CCF | Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation. |
| C-DR | Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2) |
| GCF | Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC. |
| ILC | Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation. |
| DLC | Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only. |
| HI-REL | High Reliability / MIL Versions: Available on request. (2) |
| [1] | New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table. |
| [2] | Please consult factory for detailed information. |
| [3] | These options are EMC-relevant and are recommended for industrial power applications |
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