Versatile and cost-efficient HV switch with true relay character. Negligible dynamic switching losses due to fast transistion time. Excellent dv/dt immunity against HV transients
Option | Description |
---|---|
B-CON | Beginners Configuration: The standard switch is equipped with various options to simplify first time experiments for users |
MBC | "Mechanical Backward Compatibility to the previous switch models. All connectors |
HFB | High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if > 10 pulses with < 10 μs spacing are generated. |
HFS | High Frequency Switching: Ext. supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Max. Operating Frequency” shall be exceeded. (2) |
LP | Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring. (3) |
UFTR | Ultra Fast Thermotrigger: Advanced temperature protection for the high-voltage switch. Switch shut down within 5 seconds if Pd(max) is exceeded by 300% @ ΔT=25K (50to75°C) |
UFTS | Ultra Fast Thermosensor:Temperature measurement directly on the power semiconductors by means of a special sensor with high electrical isolation and low thermal impedance. |
S-ON | Soft Turn-On: “Turn-On Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
S-OFF | Soft Turn-Off: “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
S-TT | Soft Transition Time: ”Turn-On Rise Time” & “Turn-Off Rise Time” increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3) |
TT-C | Customized Transition Time: Customized rise & fall times to meet individual design requirements. (2) |
MIN-ON | Minimum On-Time: Individually increased Minimum On-Time to ensure a minimum on duration indepently of control signal. For safety relevant circuits. |
MIN-OFF | Minimum Off-Time: Individually increased Minimum Off-Time to ensure a minimum off duration indepently of control signal. For safety relevant circuits. |
ST | Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages. |
LNC | Low Natural Capacitance: CN reduced by approx. 30%. To minimize cap. power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f). |
LL | Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series. |
LN | Low Noise: Internal power driver modified for zero noise emission for a specific period of time. Relevant in conjunction with sensitive detector amplifiers (e.g. SEV/MCP) only. (2) |
ISO-25 | 25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models. |
ISO-40 | 40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
ISO-80 | 80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
ISO-120 | 120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
I-PC | Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. capacitors |
PC | Pulser Configuration. Switch combined with custom specific part components. Integrated in a flange housing with hv connectors according to the customers specifications. (2) |
I-FWD | Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only. |
I-FWDN | Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only. |
I-TS | Integrated Thermo Sensor: Integrated temperature sensor for external temperature measurements according to customers specifications (NTC |
LS-C | LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. For improved noise immunity. (3) |
PT-C | Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-modu plug. Refers to switching modules with pins only. Suggested for modules with options CF & GCF. |
PT-HV | Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not for extremely fast circuits. |
ST-HV | Screw Terminals for HV Connection: Threaded inserts at the bottom of module for PCB attachment. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting. |
SEP-C | Separated Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails. |
FOI-I | Fibre Optics Input / Inhibit: Additional optical inhibit input to turn-off the switch by using the inhibit input with a fibre-optical signal (only in combination with option SEP-C) (2) |
FOI-C | Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2) |
FOO-F | Fibre Optical Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2) |
UL94 | Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
FH | Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested. |
TH | Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2) |
FC | Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF |
ITC | Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
CF | Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants. |
CF-1 | Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil). |
CF-X2 | "Copper Cooling Fins ""XL"": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling." |
CF-X3 | "Copper Cooling Fins ""XXL"": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling." |
CF-CS | Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1 |
CF-LC | Copper Cooling Fins for liquid cooling: Double fins |
CF-D | Double Copper Cooling Fins: Approx. 100% more cooling power |
CF-S | Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D |
CF-GRA | Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer |
CF-CER | Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm. |
CCS | Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended. |
CCF | Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation. |
C-DR | Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2) |
GCF | Grounded Cooling Flange: Nickel-plated copper flange for medium power. Max. isolation voltage 40kV. Increased coupling capacitance CC. |
ILC | Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation. |
DLC | Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only. |
HI-REL | High Reliability / MIL Versions: Available on request. (2) |
[1] | New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table. |
[2] | Please consult factory for detailed information. |
[3] | These options are EMC-relevant and are recommended for industrial power applications |