HV switches with fixed on-time, low on-resistance, MOSFET

HV switch in Trench-FET technology for extremely low on-resistance. Low control power also at higherswitching frequencies.

Features:

  • Very EMC tolerant
  • Available with on-time options from 100ns to 100μs

Application Note

Switch ModelMax. Voltage (kV)Peak Current (A)On-Resist. (Ω)On-Time (ns)Housing Dimensions (mm3 )Datasheet
HTS 30-60-B 36000.19 15089 x 64 x 31
HTS 40-06-B 4.860 1.52150135 x 20 x 20
HTS 40-12-B 4.81200.76 15079 x 38 x 25
HTS 40-26-B 4.8260 1.322079 x 38 x 25
HTS 40-60-B 4.86000.3 150122 x 64 x 31
HTS 60-24-B 62400.48 15089 x 64 x 31
HTS 60-30-B 63000.38 15089 x 64 x 31
HTS 60-60-B 66000.38 150153 x 64 x 31
HTS 70-30-B 7.23000.46 15089 x 64 x 31
HTS 90-96-B 99600.71 150204 x 103 x 35
HTS 90-06-B 9.660 3.415079 x 38 x 25
HTS 90-13-B 9.61300.6522079 x 38 x 25
HTS 90-30-B 9.63000.6 150122 x 64 x 31
HTS 100-12-B 10.8120 1.7120089 x 64 x 27
HTS 120-30-B 123000.76 150153 x 64 x 31
HTS 120-96-B 129600.48 150253 x 103 x 35
HTS 160-48-B 16.84800.67 150174 x 103 x 35
HTS 180-48-B 184800.71 150204 x 103 x 35
HTS 240-48-B 244800.95 150253 x 103 x 35
HTS 240-104-B 24 10400.4250253 x 103 x 35
OptionDescription
B-CONBeginner's Configuration: The standard switch is equipped with various options to simplify first time experiments for users which are inexperienced with high voltage and high frequency circuit design. The beginner's configuration includes option FH and PT-HV for easy wiring and attachment without printed circuit boards
HFBHigh Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.
HFSHigh Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2)
LPLow Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps.  Improved noise immunity and  less critical wiring in high speed applications. (3)
DTDelayed Trigger: “Total Turn-On Time” irreversibly increased to >1 μs. Required if national or international export restrictions apply (“dual use  products”). (2)
S-ONSoft Turn-On:  Turn-On Rise Time increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
S-OFFSoft Turn-Off:  Turn-Off Rise Time increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
S-TTSoft Transition Time:  Turn-On Rise Time & Turn-Off Rise Time increased by ~20%. Simplified EMC design and less critical wiring if the shortest possible edge steepness is not required. (3)
TT-CCustomized Transition Time:  Customized rise & fall times to meet individual design requirements. (2)
TT-PProgrammable Transition Time:  Switching speed adjustable in certain limits by means of external programming resistors. (2)
OT-1μOn-Time Extension: On-Time increased to 1 μs. Turn-Off Rise Time >500 ns.
OT-10μOn-Time Extension: On-Time increased to 10 μs. Turn-Off Rise Time > 5 μs.
OT-100μOn-Time Extension: On-Time increased to 100 μs. Turn-Off Rise Time >50 μs.
OT-CCustomized On-Time:  On-Time according to customer’s specifications. Any value between 100 ns and 100 μs.
OT-PProgrammable On-Time: On-Time adjustable in certain limits by means of external programming resistors. (2)
MIN-PSMinimum Pulse Spacing:  Individually increased Recovery Time to ensure a minimum HV pulse spacing indepently of control pulse spacing. For safety relevant circuits.
STStage Tapping:  Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).
LNCLow Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage (Pc= V2 x C x f).
LLLow Leakage Current: Off-state current reduced to less than 10%  of the specified value. Not available in connection with the cooling fin options and for switches of the UF series.
ISO-2525 kV Isolation:  Isolation Voltage increased to  25 kVDC. Housing dimensions may change for some models.
ISO-4040 kV Isolation:  Isolation Voltage increased to  40 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.
ISO-8080 kV Isolation:  Isolation Voltage increased to  80 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.
I-PCIntegrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
I-FWDIntegrated Free-Wheeling Diode:  Built-in parallel diode with short recovery time. In connection with inductive load only.
I-FWDNIntegrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode  with short recovery time. In connection with inductive load only.
SEP-CSeparate Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails
FOI-CFibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)
FOO-FFibre Optics Output / Fault: Additional optical output to read-out the failure condition with a fibre-optical signal (only in combination with option SEP-C) (2)
I-PCIntegrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
LS-CLEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3)
PT-CPigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. Recommended for modules with options CF & GCF.
PIN-CPins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.
PT-HVPigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.
ST-HVScrew Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.
UL94Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
FHFlange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.
THTubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. ‚
FCFlat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF
ITCIncreased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)
CFCopper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.
CF-1Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).
CF-X2"Copper Cooling Fins ""XL"": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-X3"Copper Cooling Fins ""XXL"": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-CSCopper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1
CF-LCCopper Cooling Fins for liquid cooling: Double fins
CF-DDouble Copper Cooling Fins: Approx. 100% more cooling power
CF-SCopper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D
CF-GRANon-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer
CF-CERIsolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.
CCSCeramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.
CCFCeramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DRCooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
GCFGrounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance Cc.
GCF-X2Grounded Cooling Flange
ILCIndirect Liquid Cooling:  Liquid cooling for all kind of conductive coolants including mains water. Internal heat exchanger made of ceramics. For medium power applications.
DLCDirect Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling solution especally for high frequency applications. For non-conductive coolants only.
HI-RELHigh Reliability / MIL Versions:  Available on request. (2)
[1]New option code:  Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table.   
[2]Please consult factory for detailed information.
[3]These options are EMC-relevant and are recommended for industrial power applications