HV switches current depending on-time, Thyristor / SCR

Unlike classical disc thyristor switches with very limited dv/dt and di/dt capabilities, the fast thyristor switching modules are made of a very large number of smaller thyristor dies (type depending up to 1000 single thyristors), connected in parallel and in series, so that the extreme dv/dt and di/dt is efficiently splitted to uncritical values for the the single thyristors. Every single thyristor is fired by its own highly synchronized and isolated gate driver. This makes a very short gate wiring possible and avoids dangerous hot spots known from classical thyristor switch designs

Features:

  • High peak current capability
  • Very overload tolerant
  • Easy firing by a simple TTL trigger pulse (2-5 V)

Application Note

Switch ModelMax. Voltage (kV)Peak Current (A)Peak Power (MW)On-Time (µs)Housing Dimensions (mm3 )Datasheet
HTS 40-1000-SCR 4100004035…∞ 89 x 64 x 31
HTS 60-1000-SCR 6100006035…∞ 122 x 64 x 31
HTS 60-100-SCR 6.41000 6.435…∞ 135 x 20 x 20
HTS 60-200-SCR 6.42000 12.835…∞ 80 x 38 x 25
HTS 80-200-SCR 820001635…∞ 89 x 64 x 31
HTS 80-500-SCR 850004035…∞ 89 x 64 x 31
HTS 80-1000-SCR 8100008035…∞ 153 x 64 x 31
HTS 100-1600-SCR 101600016035…∞ 179 x 103 x 35
HTS 120-200-SCR 1220002435…∞ 122 x 64 x 31
HTS 120-500-SCR 1250006035…∞ 122 x 64 x 31
HTS 120-1600-SCR 121600019235…∞ 204 x 103 x 35
HTS 120-100-SCR 12.81000 12.835…∞ 80 x 38 x 25
HTS 150-200-SCR 1520003035…∞ 103 x 70 x 35
HTS 160-200-SCR 1620003235…∞ 89 x 64 x 31
HTS 160-500-SCR 1650008035…∞ 153 x 64 x 31
HTS 160-200-SCR 1620003235…∞ 153 x 64 x 31
HTS 160-1600-SCR 161600025635…∞ 253 x 103 x 35
HTS 200-800-SCR 20800016035…∞ 179 x 103 x 35
HTS 220-800-SCR 22800017635…∞ 179 x 103 x 35
HTS 220-1000-SCR 221000022035…∞ 252 x 150 x 40
HTS 220-1200-SCR 221200026435…∞ 160 x 150 x 30
HTS 240-100-SCR 2410002435…∞ 103 x 70 x 35
HTS 240-800-SCR 24800019235…∞ 204 x 103 x 35
HTS 240-1000-SCR 241000024035…∞ 252 x 150 x 40
HTS 240-1200-SCR 241200028835…∞ 160 x 150 x 30
HTS 300-100-SCR 3010003035…∞ 103 x 70 x 35
HTS 320-200-SCR 3220006435…∞ 153 x 64 x 31
HTS 320-800-SCR 32800025635…∞ 253 x 103 x 35
HTS 320-200-SCR 3220006435…∞ 206 x 70 x 35
HTS 350-800-SCR 35  800028035…∞372 x 200 x 43
HTS 400-200-SCR 4020008035…∞ 312 x 120 x 38
HTS 440-1200-SCR 441200052835…∞ 312 x 200 x 45
HTS 500-1200-SCR501200060035…∞ 372 x 200 x 50
HTS 600-200-SCR 60200012035…∞ 372 x 120 x 50
HTS 640-100-SCR 6410006435…∞ 206 x 70 x 35
HTS 800-100-SCR 8010008035…∞ 312 x 120 x 38
HTS 1200-100-SCR 120100012035…∞ 372 x 120 x 50
HTS 1200-2400-SCR 12024000288035…∞ 672 x 400 x 68
HTS 1500-1000-SCR15010000150035…∞ on request
OptionsDescription
HFBHigh Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.
HFSHigh Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded.(2)
LPLow Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps.  Improved noise immunity and  less critical wiring in high speed applications. (3)
STStage Tapping:  Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).
ISO-2525 kV Isolation:  Isolation Voltage increased to  25 kVDC. Housing dimensions may change for some models.
ISO-4040 kV Isolation:  Isolation Voltage increased to  40 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.
ISO-8080 kV Isolation:  Isolation Voltage increased to  80 kVDC. Housing dimensions may change for some models.  Only in connection with option PT-HV.
ISO-120120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
I-PCIntegrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors
I-FWDIntegrated Free-Wheeling Diode:  Built-in parallel diode with short recovery time. In connection with inductive load only.
LS-CLEMO socket for Control Connection: Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3)
PT-CPigtail for Control Connection: Flexible leads (l=75 mm) with AMP-Modu plug. Only for switches with pins
PIN-CPins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.
PT-HVPigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.
ST-HVScrew Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.
SEP-CSeparated Control Unit: Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.
FOI-CFibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)
FOO-FFibre Optics Output / Fault: Additional optical output to read-out the failure condition of the switch by means of a fibre-optical signal (only in combination with option SEP-C) (2)
UL94Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
FHFlange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.
THTubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case  of difficult assembly situations. (2)
FCFlat Case: Height of standard plastic housings reduced to 19 / 25 mm. Not in combination with cooling options CF
ITCIncreased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)
CFCopper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants.
CF-1Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil).
CF-X2"Copper Cooling Fins ""XL"": Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-X3"Copper Cooling Fins ""XXL"": Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling."
CF-CSCopper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1
CF-LCCopper Cooling Fins for liquid cooling: Double fins
CF-DDouble Copper Cooling Fins: Approx. 100% more cooling power
CF-SCopper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D
CF-GRANon-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer
CF-CERIsolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.
CCSCeramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.
CCFCeramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DRCooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
GCFGrounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance. In combination with option SPT-C only.
GCF-X2Grounded Cooling Flange
ILCIndirect Liquid Cooling:  Liquid cooling for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.
DLCDirect Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling for high frequency applications. Non-conductive coolants only.
HI-RELHigh Reliability / MIL Versions:  Available on request. (2)
[1]New option code:  Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table. 
[2]Please consult factory for detailed information.
[3]These options are EMC-relevant and are recommended for industrial power applications